| Unique challenges to scheduling
semiconductor wafer fabrication |
| Large number of process
steps (generally more than 250 per product) |
|
High re-entrant process flow (lots visit the same equipment multiple
times) |
| An intermixture of single wafer and lot-based
process operations |
| Batching of multiple lots that
share process recipes and processing times |
| Some process
steps that have material life thresholds that predicate when subsequent
processes must take place |
| Equipment alignment and
calibration issues require some process steps to return to the exact piece
of equipment that processed the lot in a previous critical step |